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General Specification | | Chip Size | 0.122 x 0.145 (3.10mm X 3.68mm) | | Impedance | 50 Ohms | | Attenuation Stability | 0.0001dB/dB/C | | VSWR (Max) | 1.25 @ DC-4GHz 1.35 @ 4-8GHz 1.50 @ 8-12.4GHz
| | Power Rating | 2.0 Watts | | Power derating | 100% to 125 C | | derates to | 0% @ 150 C | | Operating Temperature | -55°C to 150°C | Material Specification | | Substrate | Aluminia | | Top Plate | Aluminia | | Resistive material | Thin film | | Terminal material | Thick film, Nickel Barrier with Solder Plated Finish | | Leads | Gold Plate over Copper | |
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