General Specification
Chip Size	0.060 x 0.075 (1.52mm x 1.91mm)
Impedance	50 Ohms
Attenuation Stability	0.0001dB/dB/C
VSWR (Max)	1.25 @ DC-4GHz 1.35 @ 4-8GHz 1.50 @ 8-18GHz
Power Rating	100 mWatts
Power derating	100% to 125 C
derates to	0% @ 150 C
Operating Temperature	-55°C to 150°C

Material Specification
Substrate	Aluminia
Top Plate	Aluminia
Resistive material	Thin film
Terminal material	Thick film, Nickel Barrier with Solder Plated Finish Gold and Wire Bondable are also available
Leads	Gold Plate over Copper